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Product Technology

Technology Capability(Hard Board)

Type Dongguann Jiangxi
Scope Double Side、Multilayers(4-20) Multilayers(4-28)、HDI(4-20)Flex、Rigid Flex
Double Side CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm) CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)
Multilayers 4-20 layers, board thickness 15mil-126mil (0.38mm-3.2mm) 4-28 layers, board thickness 8mil-126mil (0.2mm-3.2mm)
Buried/Blind Via 4-18 layers, board thickness 15mil-126mil(0.38mm-3.2mm) 4-20 layers, board thickness 10mil-126mil(0.25mm-3.2mm)
HDI / 1+N+1、2+N+2、3+N+3、Anylayer
Flex & Rigid-Flex PCB / 1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB
Laminate Shengyi、EMC、ITEQ、Panasionic、Hitachi....
Soldermask Type(LPI) Taiyo、Goo’s、Probimer..... Taiyo、Goo’s、Probimer FPC.....
Peelable Soldermask Peters
Carbon ink Nipon
HASL/Lead Free HASL Thickness: 0.5-40um Thickness: 0.5-40um
OSP Entek Plus HT, Preflux F2 LX
ENIG (Ni-Au) Au:0.03um≤max<0.06um Ni:3um≤max≤6um
Electro-bondable Ni-Au Au:0.2-1.0um Ni:2.54-10um
Electro-nickel palladium Ni-Au Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm
Electro. Hard Gold Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)
Thick tin 1.0-1.4um
Capability Mass Production Mass Production
Min Mechanical Drill Hole 0.20mm 0.20mm
Min. Laser Drill Hole / 4mil (0.100mm)
Line Width/Spacing 3mil/3mil 2mil/2mil
Max. Panel Size 18.5" X 24.5"(470mm X 622mm) 21.5" X 24.5"(546mm X 622mm)
Line Width/Spacing Tolerance +/-10% ~ +/-20% Non electro coating:+/-5um,Electro coating:+/-10um
PTH Hole Tolerance +/-0.003inch(0.075mm) +/-0.002inch(0.050mm)
NPTH Hole Tolerance +/-0.002inch(0.050mm) +/-0.002inch(0.050mm)
Hole Location Tolerance +/-0.003inch(0.075mm) +/-0.002inch(0.050mm)
Hole to Edge Tolerance +/-0.004inch(0.100mm) +/-0.004inch(0.100mm)
Edge to Edge Tolerance +/-0.004inch(0.100mm) +/-0.004inch(0.100mm)
Layer to Layer Tolerance +/-0.004inch(0.100mm) +/-0.003inch(0.075mm)
Impedance Tolerance +/- 10% +/- 10%
Warpage % Max ≤0.75% Max≤0.5%

Technology (HDI Product)

ITEM Production Tighten Control
Laser Via Drill/Pad 0.125/0.30 、 0.125/0.38 0.125/0.28 、 0.125/0.36 、 0.20/0.40
Blind Via Drill/Pad 0.25/0.50 0.20/0.45
Line Width/Spacing 0.10/0.10 0.075/0.075
Hole Formation CO2 Laser Direct Drill
Build Up Material FR4 LDP(LDD); RCC 50 ~100 micron
Cu Thickness on Hole Wall Blind Hole: 10um(min) Buried Hole: 13um(min)
Aspect Ratio 0.8 : 1

Technology (Flexible PCB)

Project  Ability
Roll to roll (one side) YES
Roll to roll (double) NO
Volume to roll material width mm  250
Minimum production size mm  250x250 
Maximum production size mm  500x500 
SMT Assembly patch (Yes/No) YES
Air Gap capability (Yes/No) YES
Production of hard and soft binding plate(Yes/No) YES
Max layers(Hard) 10
Tallest layer(Soft plate) 6
Material Science 
Electrolytic copper YES
Rolled Anneal Copper Foil YES
Covering film alignment tolerance mm ±0.1 
Minimum covering film  mm 0.175
Silver Ink YES
Silver Film YES